The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Sep. 13, 2012
Applicants:

Takaki Hashimoto, Kanagawa, JP;

Yasunobu Kai, Kanagawa, JP;

Toshiya Kotani, Tokyo, JP;

Inventors:

Takaki Hashimoto, Kanagawa, JP;

Yasunobu Kai, Kanagawa, JP;

Toshiya Kotani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 23/528 (2006.01); H01L 21/033 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/768 (2013.01); H01L 21/31144 (2013.01); H01L 21/0337 (2013.01); H01L 27/11519 (2013.01); Y10S 438/947 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a plurality of wires arranged in parallel at a predetermined pitch, a plurality at first contacts that are each connected to an odd-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to a wiring direction of the wires, and a plurality of second contacts that are each connected to an even-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to the wiring direction of the wires in such a way as to be offset from the first contacts in the wiring direction of the wires, in which the first contacts are offset from the second contacts by a pitch of the wires in an orthogonal direction with respect to the wiring direction of the wires.


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