The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
May. 18, 2010
Applicant:
Hirotaka Ohno, Miyoshi, JP;
Inventor:
Hirotaka Ohno, Miyoshi, JP;
Assignee:
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/26175 (2013.01); H01L 2924/014 (2013.01); H01L 2224/83193 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/83007 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01006 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/83385 (2013.01); H01L 24/83 (2013.01); H01L 2224/33505 (2013.01); H01L 21/4875 (2013.01); H01L 2924/0105 (2013.01); H01L 2224/32225 (2013.01); H01L 24/743 (2013.01); H01L 24/29 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/29099 (2013.01);
Abstract
A semiconductor device of the present invention has a purpose to form a structure of preventing outflow of solder at low costs. A semiconductor element is bonded to a substrate through a solder layer. An outflow-preventing part is provided to surround the solder layer to prevent solder outflow during soldering. The outflow-preventing part is formed by a cold spray method and has a surface in an oxidized state.