The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jul. 26, 2013
Applicants:
Seah Sun Too, Sammamish, WA (US);
Maxat Touzelbaev, San Jose, CA (US);
Janet Kirkland, Sonora, CA (US);
Inventors:
Seah Sun Too, Sammamish, WA (US);
Maxat Touzelbaev, San Jose, CA (US);
Janet Kirkland, Sonora, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/92225 (2013.01); H01L 23/10 (2013.01); H01L 2224/83191 (2013.01); H01L 23/42 (2013.01); H01L 2224/83192 (2013.01); H01L 24/32 (2013.01); H01L 24/29 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/83815 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/15312 (2013.01); H01L 2924/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 24/83 (2013.01); H01L 2924/16251 (2013.01);
Abstract
Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.