The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jul. 29, 2011
Sören Hartmann, Baesweiler, DE;
Christoph Rickers, Aachen, DE;
Herbert Friedrich Boerner, Aachen, DE;
Herbert Lifka, Son, NL;
Holger Schwab, Aachen, DE;
Sören Hartmann, Baesweiler, DE;
Christoph Rickers, Aachen, DE;
Herbert Friedrich Boerner, Aachen, DE;
Herbert Lifka, Son, NL;
Holger Schwab, Aachen, DE;
Koninklijke Philips N.V., Eindhoven, NL;
Abstract
The invention relates to a method enabling to apply cheap manufacturing techniques for producing reliable and robust organic thin film device (EL) comprising the steps of providing (P) a transparent substrate () at least partly covered with a first layer stack comprising at least one transparent layer (), preferably an electrically conductive layer, and a pattern of first and second opaque conductive areas () deposited on top of the transparent layer (), depositing (D) a photoresist layer () made of an electrically insulating photoresist resist material on top of the first layer stack at least fully covering the second opaque conductive areas (), illuminating (IL) the photoresist layer () through the transparent substrate () with light () of a suitable wavelength to make the photoresist material soluble in the areas () of the photoresist layer () having no opaque conductive areas () underneath, removing (R) the soluble areas () of the photoresist layer (), heating (B) the areas () of the photoresist layer () remaining on top of at least the second opaque conductive areas () to re-flow the photoresist layer () to cover the edges (E) of the second opaque conductive areas () in contact to the transparent layer (), and hardening (H) the remaining areas () of the photoresist layer (). The invention further relates to a conductive component (CC) for use in these organic thin film devices (EL) and to the organic thin film devices (EL) itself.