The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
May. 11, 2012
Applicant:
Yoshinobu Goto, Nagoya, JP;
Inventor:
Yoshinobu Goto, Nagoya, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 9/00 (2006.01); B32B 19/00 (2006.01); C22C 29/16 (2006.01); C22C 29/06 (2006.01); C04B 41/87 (2006.01); C04B 41/50 (2006.01); C22C 29/12 (2006.01); C04B 41/00 (2006.01);
U.S. Cl.
CPC ...
C04B 41/5032 (2013.01); C22C 29/16 (2013.01); C22C 29/065 (2013.01); C04B 41/87 (2013.01); C22C 29/12 (2013.01); C04B 41/009 (2013.01); C04B 41/5045 (2013.01);
Abstract
A plasma-resistant member according to the present invention includes a base member formed of a silicon nitride sintered body, an aluminum nitride sintered body, an alumina sintered body, or a silicon carbide sintered body; and a thin film formed on a surface of the base member and composed of an yttrium compound or a spinel, wherein the thin film has, in a surface of the thin film, a plurality of projections for supporting a wafer, and a ratio a/aof a film thickness aof portions of the thin film that include the projections to a film thickness aof portions of the thin film that do not include the projections satisfies 1<a/a<1.6.