The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

May. 29, 2007
Applicants:

Rajmohan Bhandari, Salt Lake City, UT (US);

Sandeep Negi, Salt Lake City, UT (US);

Florian Solzbacher, Salt Lake City, UT (US);

Richard A. Normann, Park City, UT (US);

Inventors:

Rajmohan Bhandari, Salt Lake City, UT (US);

Sandeep Negi, Salt Lake City, UT (US);

Florian Solzbacher, Salt Lake City, UT (US);

Richard A. Normann, Park City, UT (US);

Assignee:

University of Utah Research Foundation, Salt Lake City, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B44C 1/22 (2006.01); A61B 5/04 (2006.01); H01L 21/77 (2006.01); H01L 29/08 (2006.01); A61M 37/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); A61M 2037/0053 (2013.01); A61M 2037/0046 (2013.01);
Abstract

A micro-needle array having tips disposed along a non-planar surface is formed by shaping the wafer surface into a non-planar surface to define the tips of the micro-needles. A plurality of trenches are cut into the wafer to form a plurality of columns having tops corresponding to the non-planar surface. The columns are rounded and sharpened by etching to form the micro-needles.


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