The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Feb. 08, 2012
Applicants:

Takahiro Osuki, Nishinomiya, JP;

Kazuhiro Ogawa, Nishinomiya, JP;

Hiroyuki Hirata, Neyagawa, JP;

Yoshitaka Nishiyama, Nishinomiya, JP;

Inventors:

Takahiro Osuki, Nishinomiya, JP;

Kazuhiro Ogawa, Nishinomiya, JP;

Hiroyuki Hirata, Neyagawa, JP;

Yoshitaka Nishiyama, Nishinomiya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 38/42 (2006.01); C22C 38/00 (2006.01); C22C 38/06 (2006.01); C22C 38/02 (2006.01); C22C 38/40 (2006.01); C22C 38/46 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01); C22C 38/04 (2006.01);
U.S. Cl.
CPC ...
C22C 38/001 (2013.01); C22C 38/06 (2013.01); C22C 38/02 (2013.01); C22C 38/40 (2013.01); C22C 38/46 (2013.01); C22C 38/42 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/04 (2013.01);
Abstract

An austenitic stainless steel, which consists of by mass percent, C: not more than 0.02%, Si: not more than 1.5%, Mn: not more than 2%, Cr: 17 to 25%, Ni: 9 to 13%, Cu: more than 0.26% not more than 4%, N: 0.06 to 0.35%, sol. Al: 0.008 to 0.03%. One or more elements selected from Nb, Ti, V, TA, Hf, and Zr in controlled amounts can be included with the balance being Fe and impurities. P, S, Sn, As, Zn, Pb and Sb among the impurities are controlled as P: 0.006 to 0.04%, S: 0.0004 to 0.03%, Sn: 0.001 to 0.1%, As: not more than 0.01%, Zn: not more than 0.01%, Pb: not more than 0.01% and Sb: not more than 0.01%. The amounts of S, P, Sn, As, Zn, Pb and Sb and the amounts of Nb, Ta, Zr, Hf, and Ti are further controlled using formulas.


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