The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jul. 21, 2011
Kazunari Kimura, Tokyo, JP;
Misaki Tabata, Tokyo, JP;
Shigemitsu Tomaki, Tokyo, JP;
Akira Nakamura, Tokyo, JP;
Isao Abe, Tokyo, JP;
Noriyuki Saito, Tokyo, JP;
Kazunari Kimura, Tokyo, JP;
Misaki Tabata, Tokyo, JP;
Shigemitsu Tomaki, Tokyo, JP;
Akira Nakamura, Tokyo, JP;
Isao Abe, Tokyo, JP;
Noriyuki Saito, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.