The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Mar. 12, 2012
Applicant:

I-ming Chen, New Taipei, TW;

Inventor:

I-Ming Chen, New Taipei, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21V 29/02 (2006.01); F21V 21/00 (2006.01); F21V 15/01 (2006.01); F21V 21/04 (2006.01); F21V 23/00 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
F21V 29/2287 (2013.01); F21V 15/011 (2013.01); F21V 23/009 (2013.01); F21V 21/044 (2013.01); F21Y 2101/02 (2013.01);
Abstract

An LED bulb comprises a lamp cup, a substrate, a power connecting part, and a cover plate. The lamp cup is a two-piece structure; a power driver is further disposed in the power connecting part. The substrate is disposed in the lamp cup, while the power connecting part connects with the lamp cup. When the light sources and the power structure generate heat, the generated heat can be transferred outwards and dissipated through the lamp cup or the power connecting part. Because the heat generated by both of the heat sources in the lamp cup, respectively, the co-heating effect induced by the light sources and the power driver can be avoided. The overall structure is manufactured by materials having superior thermal conductivity. Thereby, with the structure, heat dissipating process can be accelerated. The lifetime of the light sources can be improved substantially.


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