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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8863378 B1

PDFFull Text
Date of Patent:
Oct. 21, 2014

Filed:

Feb. 16, 2010

Method for manufacturing a wiring board

Applicants:

Masaki Muramatsu, Komaki, JP;

Shinji Yuri, Kasugai, JP;

Makoto Origuchi, Komaki, JP;

Kazuhiro Urashima, Konan, JP;

Inventors:

Masaki Muramatsu, Komaki, JP;

Shinji Yuri, Kasugai, JP;

Makoto Origuchi, Komaki, JP;

Kazuhiro Urashima, Konan, JP;

Assignee:

NGK Spark Plug Co., Ltd., Aichi, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Thiem Phan

Int. Cl.
CPC ...
H01K 3/10 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/14 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 23/50 (2013.01); H01L 2924/01047 (2013.01); H05K 1/0231 (2013.01); H01L 2924/19041 (2013.01); H01L 24/97 (2013.01); H05K 2201/096 (2013.01); H01L 2924/01027 (2013.01); H05K 1/185 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01059 (2013.01); H01L 2924/30107 (2013.01); H05K 1/112 (2013.01); H01L 21/4857 (2013.01); H01L 24/81 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/01078 (2013.01); H01L 21/568 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/14 (2013.01); H05K 1/162 (2013.01); H01L 2224/97 (2013.01); H05K 2201/10712 (2013.01); H01L 23/49822 (2013.01); H01L 2924/01075 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H05K 1/142 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/01006 (2013.01); H05K 3/4602 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/0105 (2013.01); H01L 2224/13111 (2013.01); H05K 2201/10674 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A method for manufacturing a wiring board including, as steps executed in written order: a sub-core accommodation step of accommodating the ceramic sub-core in the sub-core accommodation space through the first-major-surface-side opening of the sub-core accommodation space; and a film formation and charging step of forming a lowest resin insulating layer of the first-major-surface-side wiring laminate by sticking a resin material to the core body and the ceramic sub-core from the first major surface side, and forming a groove-filling portion that is continuous with the lowest resin insulating layer by charging the resin material into a gap between the core body and the ceramic sub-core.

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