The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Jun. 02, 2011
Albert M. Chu, Essex, VT (US);
Eric D. Johnson, Westford, VT (US);
William J. Rensch, Williston, VT (US);
Manikandan Viswanath, South Burlington, VT (US);
Albert M. Chu, Essex, VT (US);
Eric D. Johnson, Westford, VT (US);
William J. Rensch, Williston, VT (US);
Manikandan Viswanath, South Burlington, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Systems and methods for determining adjustable wafer acceptance criteria based on chip characteristics. The method includes measuring a density of at least one chip. The method further includes computing a difference in density between the density of the at least one chip and a density of at least one kerf structure. The method further includes calculating an offset value to modify a Wafer Acceptance Criteria (WAC) to match the density difference between the at least one chip and the at least one kerf structure. The method further includes applying the offset value to the WAC for a wafer level measurement in order to increase chip yield performance.