The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jan. 18, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Gyunggi-do, KR;

Inventors:

Chang Ho Lee, Gyunggi-do, KR;

Dong Hwan Seo, Gyunggi-do, KR;

Sang Hyun Park, Gyunggi-do, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); H01G 4/30 (2013.01); H01G 4/2325 (2013.01); H01G 4/232 (2013.01); H01G 4/12 (2013.01);
Abstract

There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, Lis a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, Tis a thickness of the first layer, and Tis a thickness of the second layer, Tc≦70 μm, T≧(1.5)T, and L<(1.5)Tc are satisfied, thus providing excellent reliability.


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