The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Feb. 08, 2012
Applicants:

Naoto Kaguchi, Tokyo, JP;

Masaaki Ikegami, Tokyo, JP;

Inventors:

Naoto Kaguchi, Tokyo, JP;

Masaaki Ikegami, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01); G01R 31/12 (2006.01);
U.S. Cl.
CPC ...
G01R 1/04 (2013.01); G01R 1/06777 (2013.01); H01L 22/14 (2013.01); G01R 31/2886 (2013.01); G01R 31/2887 (2013.01); G01R 31/129 (2013.01); G01R 31/2879 (2013.01);
Abstract

A jig for use in a semiconductor test includes: a base on which a probe pin and an insulating material are placed, the insulating material surrounding the probe pin in plan view; and a stage arranged to face a surface of the base on which the probe pin and the insulating material are placed. The stage is capable of holding a test object on a surface of the stage facing the base. When the base and the stage move in a direction in which they go closer to each other while the test object is placed on the stage, the probe pin comes into contact with an electrode formed on the test object and the insulating material comes into contact with the test object.


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