The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Dec. 15, 2011
Applicant:
Yumiko Miura, Tokyo, JP;
Inventor:
Yumiko Miura, Tokyo, JP;
Assignee:
PS4 Luxco S.A.R.L., Luxembourg, LU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); H01L 2225/06541 (2013.01); H01L 25/0652 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06565 (2013.01); H01L 23/49811 (2013.01); H01L 24/97 (2013.01); H01L 23/49827 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06568 (2013.01);
Abstract
A semiconductor device has a wiring substrate, a first semiconductor chip, a second semiconductor chip, and a sealing member. The second semiconductor chip has a chip-layered structure with a plurality of semiconductor chip components stacked in the height direction of the semiconductor device. The first semiconductor chip has an upper surface located at the same height from a surface of the wiring substrate as an upper surface of the second semiconductor chip.