The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Jun. 10, 2009
Eisaku Kakiuchi, Toyota, JP;
Yasuji Taketsuna, Okazaki, JP;
Masahiro Morino, Okazaki, JP;
Yuya Takano, Nishio, JP;
Eisaku Kakiuchi, Toyota, JP;
Yasuji Taketsuna, Okazaki, JP;
Masahiro Morino, Okazaki, JP;
Yuya Takano, Nishio, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Abstract
Disclosed is a semiconductor device that can properly relax a stress produced by a difference in coefficient of linear expansion between an insulating substrate and a cooler and can properly remove heat by cooling of a semiconductor element. A semiconductor device comprises an insulating substrate, a semiconductor element provided on the insulating substrate, a cooler, and a porous metal plate provided between the insulating substrate and the cooler. Through holes in the porous metal plate are open at least to that surface of the porous metal plate which faces the cooler. The sectional size of the pores decreases gradually from the cooler side toward the insulating substrate side.