The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Feb. 03, 2012
Applicants:
Cheol-jun Yoo, Chungcheongnam-do, KR;
Young-hee Song, Gyeonggi-do, KR;
Inventors:
Cheol-jun Yoo, Chungcheongnam-do, KR;
Young-hee Song, Gyeonggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/005 (2013.01); H01L 2224/48091 (2013.01);
Abstract
A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.