The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Jun. 16, 2011
Applicants:
Markus Schneider, Nittendorf-Schönhofen, DE;
David Racz, Regensburg, DE;
Johann Ramchen, Altdorf, DE;
Inventors:
Markus Schneider, Nittendorf-Schönhofen, DE;
David Racz, Regensburg, DE;
Johann Ramchen, Altdorf, DE;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 33/46 (2010.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/50 (2013.01); H01L 33/62 (2013.01); H01L 33/46 (2013.01); H01L 33/20 (2013.01); H01L 2924/1715 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48227 (2013.01);
Abstract
An optoelectronic semiconductor component includes a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and having a radiation-transmissive substrate and a semiconductor layer sequence which includes at least one active layer that generates electromagnetic radiation, and a reflective potting material, wherein, starting from the carrier top, the potting material surrounds the semiconductor chip in a lateral direction at least up to half the height of the substrate.