The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Jul. 16, 2012
Applicants:
Seiji Yamaguchi, Kiyosu, JP;
Koji Tasumi, Kiyosu, JP;
Inventors:
Seiji Yamaguchi, Kiyosu, JP;
Koji Tasumi, Kiyosu, JP;
Assignee:
Toyoda Gosei Co., Ltd., Kiyosu-Shi, Aichi-Ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); C03B 19/06 (2006.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); C03B 19/063 (2013.01);
Abstract
The light emitting devicecomprises a mounting substrate, LED chipsflip-chip bonded on the mounting substrate, and a glass sealing membermade of a plate-shaped glass material that seals the LED chipsformed on the mounting substrate. Here, the glass sealing memberis in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dipsare almost evenly dispersed and distributed on the surface of the glass sealing member