The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Apr. 28, 2009
Applicants:
Shigehiro Ueno, Tokyo-to, JP;
Masato Okada, Tokyo-to, JP;
Keisuke Hashimoto, Tokyo-to, JP;
Inventors:
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 35/24 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 51/009 (2013.01); Y02E 10/549 (2013.01); Y02E 10/542 (2013.01); H01L 51/0035 (2013.01); H01L 51/5088 (2013.01); H01L 51/0039 (2013.01);
Abstract
A device having an easy production process and capable of achieving a long lifetime. The device has a substrate, two or more electrodes facing each other disposed on the substrate and a positive hole injection transport layer disposed between two electrodes among the two or more electrodes. The positive hole injection transport layer contains a reaction product of a molybdenum complex or tungsten complex.