The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Sep. 30, 2008
Cheng-yi LU, West Hills, CA (US);
James A. Mcclanahan, Woodland Hills, CA (US);
Joseph P. Carroll, Moorpark, CA (US);
William Determan, Sylmar, CA (US);
Patrick E. Frye, Simi Valley, CA (US);
Charles Thomas Kudija, Santa Clara, CA (US);
Rick L. Howerton, Simi Valley, CA (US);
Kenneth John Metcalf, Simi Valley, CA (US);
Andrew J. Zillmer, Woodland Hills, CA (US);
Cheng-Yi Lu, West Hills, CA (US);
James A. McClanahan, Woodland Hills, CA (US);
Joseph P. Carroll, Moorpark, CA (US);
William Determan, Sylmar, CA (US);
Patrick E. Frye, Simi Valley, CA (US);
Charles Thomas Kudija, Santa Clara, CA (US);
Rick L. Howerton, Simi Valley, CA (US);
Kenneth John Metcalf, Simi Valley, CA (US);
Andrew J. Zillmer, Woodland Hills, CA (US);
Aerojet Rocketdyne of DE, Inc., Sacramento, CA (US);
Abstract
A heat rejection system includes a plurality of panel subassemblies and a solid state heat pipe flex joint. Each panel subassembly includes a fin, a solid state heat pipe manifold, a first solid state heat pipe tube operatively connected to the solid state heat pipe manifold and secured to the fin, a second solid state heat pipe tube operatively connected to the solid state heat pipe manifold adjacent to the first solid state heat pipe and secured to the fin. The solid state heat pipe flex joint operably connects the solid state heat pipe manifolds of two of the plurality of panel subassemblies in a hermetically sealed configuration, and is configured to permit repositioning of the two panel subassemblies relative to each other.