The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Aug. 23, 2013
Applicant:

Mosel Vitelic Inc., Hsinchu, TW;

Inventor:

Chien-Ping Chang, Hsinchu, TW;

Assignee:

Mosel Vitelic Inc., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 23/10 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66333 (2013.01);
Abstract

A manufacturing method of a power semiconductor includes steps of providing a first semiconductor substrate and a second semiconductor substrate, forming a metal oxide semiconductor layer on a first surface of the first semiconductor substrate, grinding a second surface of the first semiconductor substrate, forming a N-type buffer layer and a P-type injection layer on a third surface of the second semiconductor substrate through ion implanting, grinding a fourth surface of the second semiconductor substrate, and combining the second surface of the first semiconductor substrate with the third surface of the second semiconductor substrate for forming a third semiconductor substrate. As a result, the present invention achieves the advantages of enhancing the process flexibility and un-limiting the characteristics of the power semiconductor.


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