The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Dec. 13, 2010
Applicants:
Stephen J Gaul, Melbourne Village, FL (US);
Steven Howard Voldman, South Burlington, VT (US);
Jean-michel Tschann, Melbourne, FL (US);
Inventors:
Stephen J Gaul, Melbourne Village, FL (US);
Steven Howard Voldman, South Burlington, VT (US);
Jean-Michel Tschann, Melbourne, FL (US);
Assignee:
Soitec, Bernin, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/861 (2006.01); H01L 23/367 (2006.01); H01L 23/60 (2006.01); H01L 23/373 (2006.01); H01L 29/737 (2006.01); H01L 29/73 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/861 (2013.01); H01L 29/737 (2013.01); H01L 29/73 (2013.01); H01L 29/0653 (2013.01); H01L 23/367 (2013.01); H01L 23/60 (2013.01); H01L 23/3732 (2013.01); H01L 2924/14 (2013.01); H01L 23/3677 (2013.01);
Abstract
Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribution structure is thermally isolated and reduces a thermal gradient between the first device and the second device.