The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Oct. 29, 2012
Applicant:
Byd Company Limited, Shenzhen, CN;
Inventors:
Xilin Su, Shenzhen, CN;
Hongpo Hu, Shenzhen, CN;
Chunlin Xie, Shenzhen, CN;
Wang Zhang, Shenzhen, CN;
Qiang Wang, Shenzhen, CN;
Assignee:
BYD Company Limited, Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 33/38 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/382 (2013.01); H01L 2933/0016 (2013.01); H01L 33/007 (2013.01);
Abstract
A semiconductor device comprises a substrate; a conductive layer deposited on a substrate, the conductive layer being patterned to include a first pattern, the first pattern including a major surface and a plurality of grids defined in the major surface, the major surface including first lines and a connecting portion, wherein the connecting portion is connected to an electrode; and an epitaxial layer disposed on the conductive layer, covering the grids and the first line between the adjacent grids.