The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jun. 14, 2012
Applicants:

Jong Sun Maeng, Gwangju, KR;

Ki Ho Park, Hwaseong, KR;

Bum Joon Kim, Seoul, KR;

Hyun Seok Ryu, Suwon, KR;

Jung Hyun Lee, Ansan, KR;

Boung Kyun Kim, Suwon, KR;

Ki Sung Kim, Suwon, KR;

Suk Ho Yoon, Seoul, KR;

Inventors:

Jong Sun Maeng, Gwangju, KR;

Ki Ho Park, Hwaseong, KR;

Bum Joon Kim, Seoul, KR;

Hyun Seok Ryu, Suwon, KR;

Jung Hyun Lee, Ansan, KR;

Boung Kyun Kim, Suwon, KR;

Ki Sung Kim, Suwon, KR;

Suk Ho Yoon, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/32 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/007 (2013.01); H01L 33/0079 (2013.01);
Abstract

There is provided a method of manufacturing a semiconductor light emitting device, the method including: sequentially growing a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer on a semiconductor growth substrate to form a light emitting part; forming a support part on the second conductivity type semiconductor layer to be coupled to the light emitting part; separating the semiconductor growth substrate from the light emitting part; and applying an etching gas to the semiconductor growth substrate to remove a residue of the first conductivity type semiconductor layer from a surface of the semiconductor growth substrate.


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