The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jan. 27, 2010
Applicants:

Shigeru Gotoh, Higashiomi, JP;

Youhei Sakai, Higashiomi, JP;

Kentaro Okushima, Higashiomi, JP;

Inventors:

Shigeru Gotoh, Higashiomi, JP;

Youhei Sakai, Higashiomi, JP;

Kentaro Okushima, Higashiomi, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 7/38 (2006.01); B29C 33/60 (2006.01); B01J 2/10 (2006.01); B28B 7/34 (2006.01); B05D 3/00 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
B01J 2/10 (2013.01); B29C 33/60 (2013.01); B28B 7/346 (2013.01); B05D 3/002 (2013.01); B05D 3/0218 (2013.01);
Abstract

A method for forming a mold comprises forming a body by kneading a ceramic powder comprising a silicon nitride powder and a first binder solution; forming a slurry by adding a second binder solution to the body; and forming a release layer by attaching the slurry to a surface of a mold base. A method for manufacturing a solar cell element comprises forming a silicon ingot by solidifying a silicon melt in the mold obtained by the above-described method for forming a mold; slicing the silicon ingot into substrates each having a predetermined thickness; forming a diffusion layer on each of the substrates; and forming an electrode on a surface of the diffusion layer.


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