The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Aug. 07, 2012
Applicant:
Seok-whan Chung, Hwaesong-si, KR;
Inventor:
Seok-whan Chung, Hwaesong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 8/14 (2006.01); H02N 11/00 (2006.01); B32B 37/14 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B32B 37/14 (2013.01); H02N 11/00 (2013.01); B32B 38/10 (2013.01);
Abstract
An ultrasonic transducer and a method of manufacturing the same. The ultrasonic transducer includes a substrate, a supporting unit that is disposed on the substrate and comprises a through-hole, a thin-film disposed over the substrate in a region corresponding to the through-hole, wherein the thin-film is separated from the substrate and the supporting unit, and a connection unit that connects the supporting unit to the thin-film. In the method of manufacturing the ultrasonic transducer, a plurality of SOI wafers and a Si wafer are bonded without performing an aligning process.