The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Jan. 23, 2013
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Boguslaw A. Swedek, Cupertino, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24D 11/02 (2006.01); B24B 37/013 (2012.01); B24B 49/02 (2006.01); B24B 49/10 (2006.01); G01B 7/06 (2006.01); B24B 37/20 (2012.01); B24B 49/12 (2006.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 37/205 (2013.01); B24B 37/013 (2013.01); B24B 49/02 (2013.01); B24B 49/105 (2013.01); G01B 7/105 (2013.01); B24B 49/12 (2013.01); B24B 49/10 (2013.01); B24B 37/26 (2013.01); B24D 11/02 (2013.01);
Abstract
A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.