The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Jun. 05, 2012
Applicant:

Zdenko Grajcar, Crystal, MN (US);

Inventor:

Zdenko Grajcar, Crystal, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21V 21/00 (2006.01); F21V 23/06 (2006.01); F21K 99/00 (2010.01); H05K 1/02 (2006.01); F28F 3/02 (2006.01); F21Y 101/02 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F21V 29/2206 (2013.01); F21V 21/00 (2013.01); H05K 1/0204 (2013.01); F21V 29/2275 (2013.01); F28F 3/022 (2013.01); F21V 29/2293 (2013.01); F21V 29/2231 (2013.01); F21Y 2101/02 (2013.01); F21V 23/06 (2013.01); F21K 9/137 (2013.01); H01L 33/642 (2013.01);
Abstract

A device for producing light may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of the PCBs may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.


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