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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8857487 B1

PDFFull Text
Date of Patent:
Oct. 14, 2014

Filed:

Mar. 11, 2008

Room temperature bonding apparatus

Applicants:

Takeshi Tsuno, Yokohama, JP;

Takayuki Goto, Yokohama, JP;

Masato Kinouchi, Yokohama, JP;

Satoshi Tawara, Yokohama, JP;

Jun Utsumi, Yokohama, JP;

Yoichiro Tsumura, Hiroshima, JP;

Kensuke Ide, Ritto, JP;

Takenori Suzuki, Ritto, JP;

Inventors:

Takeshi Tsuno, Yokohama, JP;

Takayuki Goto, Yokohama, JP;

Masato Kinouchi, Yokohama, JP;

Satoshi Tawara, Yokohama, JP;

Jun Utsumi, Yokohama, JP;

Yoichiro Tsumura, Hiroshima, JP;

Kensuke Ide, Ritto, JP;

Takenori Suzuki, Ritto, JP;

Assignee:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Richard Crispino

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67778 (2013.01); H01L 21/6732 (2013.01); H01L 21/67748 (2013.01); H01L 21/68 (2013.01); H01L 21/683 (2013.01); H01L 21/67092 (2013.01);
Abstract

A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface.

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