The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Feb. 03, 2010
Applicants:

Twan Van Lippen, Bladel, NL;

Geert Langereis, Eindhoven, NL;

Martijn Goossens, Veldhoven, NL;

Inventors:

Twan van Lippen, Bladel, NL;

Geert Langereis, Eindhoven, NL;

Martijn Goossens, Veldhoven, NL;

Assignee:

NXP, B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H01L 21/02 (2006.01); H04R 1/24 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); H04R 1/245 (2013.01); B81C 1/00182 (2013.01); H04R 2499/11 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0257 (2013.01);
Abstract

The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a waferhaving a first layer, the method comprising the steps of dividing the first layerinto a microphone layerand into an accelerometer layer, covering a front side of the microphone layerand a front side of the accelerometer layerwith a continuous second layer, covering the second layerwith a third layer, forming a plurality of trenchesin the third layer, removing a partof the waferbelow a back side of the microphone layer, forming at least two wafer trenchesin the waferbelow a back side of the accelerometer layer, and removing a partof the second layerthrough the plurality of trenchesformed in the third layer. The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.


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