The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jun. 22, 2010
Shingo Yamamoto, Otsu, JP;
Akio Sumiya, Kusatsu, JP;
Yasuo Matsuda, Kusatsu, JP;
Naoto Inoue, Kusatsu, JP;
Makoto Tami, Shanghai, CN;
Ryo Sugihara, Takeo, JP;
Fumiaki Tanaka, Ogi, JP;
Shintaro Hara, Takeo, JP;
Shota Akinaga, Osaka, JP;
Shingo Yamamoto, Otsu, JP;
Akio Sumiya, Kusatsu, JP;
Yasuo Matsuda, Kusatsu, JP;
Naoto Inoue, Kusatsu, JP;
Makoto Tami, Shanghai, CN;
Ryo Sugihara, Takeo, JP;
Fumiaki Tanaka, Ogi, JP;
Shintaro Hara, Takeo, JP;
Shota Akinaga, Osaka, JP;
Omron Corporation, Kyoto, JP;
Abstract
A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.