The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Mar. 22, 2010
Applicants:
Matthew Daniel Neumann, Roseville, CA (US);
Timothy Michael Rau, Sacramento, CA (US);
Inventors:
Matthew Daniel Neumann, Roseville, CA (US);
Timothy Michael Rau, Sacramento, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); E04H 1/00 (2006.01); E04H 3/00 (2006.01); E04H 5/00 (2006.01); E04H 6/00 (2006.01); E04H 9/00 (2006.01); E04H 14/00 (2006.01); F25B 45/00 (2006.01); G05D 23/00 (2006.01); G06F 1/20 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1497 (2013.01); H05K 5/0004 (2013.01); G06F 1/20 (2013.01); H05K 7/14 (2013.01); G06F 2200/201 (2013.01); H05K 7/2049 (2013.01); H05K 7/1488 (2013.01); H05K 7/20254 (2013.01); H05K 5/02 (2013.01); H05K 7/2039 (2013.01); G06F 1/206 (2013.01); H05K 7/1485 (2013.01); H05K 7/20409 (2013.01); H05K 5/00 (2013.01);
Abstract
A data center includes a modular building structure forming an enclosure having a bottom side. An external support system extends from the modular building structure. A series of heat sinks are each configured to extend from an interior to an exterior of the enclosure and protrude below the bottom side of the modular building structure into a fluid. Electronic components and devices are housed within the enclosure.