The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Dec. 02, 2011
Qun Huang, Shenzhen, CN;
Che-yu Chou, New Taipei, TW;
Tai-shan Zhu, Shenzhen, CN;
Ji-ping Wu, Shenzhen, CN;
Qun Huang, Shenzhen, CN;
Che-Yu Chou, New Taipei, TW;
Tai-Shan Zhu, Shenzhen, CN;
Ji-Ping Wu, Shenzhen, CN;
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A buffer assembly includes a buffer body and an adhesive layer on the buffer body. The buffer body includes a buffer portion and a mounting portion surrounding the buffer portion. The adhesive layer includes a first adhesive portion and a second adhesive portion surrounding the first adhesive portion. The first adhesive portion and the second adhesive portion respectively correspond to the buffer portion and the mounting portion. A first cutting line is disposed between the buffer portion and the mounting portion such that the mounting portion is separable from the buffer portion along the first cutting line. A second cutting line is disposed between the first adhesive portion and the second adhesive portion such that the second adhesive portion is separable from the first adhesive portion along the second cutting line. The second cutting line superposes the first cutting line.