The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jun. 11, 2012
Yi-chun Lin, Nan Tou County, TW;
Ming-kung Wu, Tai Chung, TW;
Hsiao-ping LI, Tai Chung, TW;
Ping-wen Huang, Tai Chung, TW;
Cheng-yi Chou, Yun Lin County, TW;
Yu-hua Wu, Tao Yuan County, TW;
Xuan-chang Shiu, Chang Hua County, TW;
Chih-yuan Wang, Tai Chung County, TW;
Ching-fu Hsu, Tai Chung County, TW;
Shiao-hui Liao, Taichung, TW;
Ting-yu Chang, Kao Hsiung County, TW;
Fa-chen Wu, Tai Chung, TW;
Wen-chun Wang, Taichung, TW;
Yi-Chun Lin, Nan Tou County, TW;
Ming-Kung Wu, Tai Chung, TW;
Hsiao-Ping Li, Tai Chung, TW;
Ping-Wen Huang, Tai Chung, TW;
Cheng-Yi Chou, Yun Lin County, TW;
Yu-Hua Wu, Tao Yuan County, TW;
Xuan-Chang Shiu, Chang Hua County, TW;
Chih-Yuan Wang, Tai Chung County, TW;
Ching-Fu Hsu, Tai Chung County, TW;
Shiao-Hui Liao, Taichung, TW;
Ting-Yu Chang, Kao Hsiung County, TW;
Fa-Chen Wu, Tai Chung, TW;
Wen-Chun Wang, Taichung, TW;
Wintek Corporation, Taichung, TW;
Abstract
A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.