The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Nov. 16, 2009
Applicants:

Antonius Johannes Matheus DE Graauw, Haelen, NL;

Freek Egbert Van Straten, Mook, NL;

Assignee:

NXP, B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 2924/15311 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/3011 (2013.01); H01Q 23/00 (2013.01); H01L 2924/1532 (2013.01);
Abstract

A millimeter-wave radio antenna module () comprising: an antenna substrate () having an antenna () provided on a face thereof; and a semiconductor die () comprising a wireless system IC, the die mounted on a face of the antenna substrate and configured to provide a signal to the antenna, wherein a ball grid array () is formed on a face of the antenna substrate for mounting the antenna module to a circuit board, the ball grid array being configured to define an air dielectric gap () between the antenna and the circuit board.


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