The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Feb. 25, 2010
Applicants:

Hiroshi Uchimura, Kirishima, JP;

Nobuki Hiramatsu, Soraku-gun, JP;

Kazuki Hayata, Soraku-gun, JP;

Inventors:

Hiroshi Uchimura, Kirishima, JP;

Nobuki Hiramatsu, Soraku-gun, JP;

Kazuki Hayata, Soraku-gun, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/10 (2006.01); H01P 5/107 (2006.01); H01L 23/66 (2006.01); H01P 3/12 (2006.01); H01Q 13/10 (2006.01); H01Q 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01P 5/1015 (2013.01); H01L 23/13 (2013.01); H01L 23/66 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49433 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/20752 (2013.01); H01L 2924/20758 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3011 (2013.01); H01P 3/121 (2013.01); H01Q 13/10 (2013.01); H01Q 23/00 (2013.01); H01L 24/48 (2013.01); H01L 2924/01033 (2013.01);
Abstract

A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot.


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