The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jun. 03, 2011
Hai Dau, San Ramon, CA (US);
Rupinder S. Mand, San Jose, CA (US);
Jaspreet Singh, San Jose, CA (US);
John Williamson, Menlo Park, CA (US);
Hai Dau, San Ramon, CA (US);
Rupinder S. Mand, San Jose, CA (US);
Jaspreet Singh, San Jose, CA (US);
John Williamson, Menlo Park, CA (US);
Other;
Abstract
In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance.