The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Sep. 18, 2009
Applicants:

Christoph Menzel, New London, NH (US);

Gregory Debrabander, San Jose, CA (US);

Corina Nistorica, San Jose, CA (US);

Inventors:

Christoph Menzel, New London, NH (US);

Gregory DeBrabander, San Jose, CA (US);

Corina Nistorica, San Jose, CA (US);

Assignee:

FUJIFILM Dimatix, Inc., Lebanon, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/22 (2006.01); B41J 2/045 (2006.01); H01L 41/313 (2013.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0973 (2013.01); H01L 41/313 (2013.01);
Abstract

A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.


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