The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
May. 04, 2012
Applicants:
Olaf Pfenningstorf, Hamburg, DE;
Wolfgang Schnitt, Hamburg, DE;
Inventors:
Olaf Pfenningstorf, Hamburg, DE;
Wolfgang Schnitt, Hamburg, DE;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/485 (2006.01); H01L 23/31 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 23/485 (2013.01); H01L 23/3185 (2013.01); H01L 2924/0002 (2013.01); H01L 23/31 (2013.01);
Abstract
Aspects of the disclosure are directed towards an efficient wafer level chip-scale package, and methods or producing the packages. Various aspects are directed to protecting against humidity, contamination, mechanical damage, and current leakage while maintaining isolation and manufacturability of the plastic package and a ratio of active die size to package size.