The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jan. 26, 2012
Applicant:
Takumi Ihara, Yokohama, JP;
Inventor:
Takumi Ihara, Yokohama, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 24/73 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01049 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01023 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/1626 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01051 (2013.01); H01L 23/3675 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/014 (2013.01); H01L 24/16 (2013.01); H01L 2924/3511 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/16251 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/0103 (2013.01); H01L 23/552 (2013.01); H01L 24/32 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, and a heat conductive member composed of a solder material. The heat conductive member covers the semiconductor element, and is connected to a connection pad formed on the substrate. A heat radiator is disposed on the heat conductive member. The heat conductive member thermally connecting the semiconductor element to the heat radiator reduces the risk that electromagnetic noise may be emitted from or may be incident on the semiconductor element.