The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Aug. 10, 2012
Applicants:

Scott G. Adams, Ithaca, NY (US);

Andrew J. Minnick, Ithaca, NY (US);

Charles W. Blackmer, Ithaca, NY (US);

Mollie K. Devoe, Ithaca, NY (US);

Inventors:

Scott G. Adams, Ithaca, NY (US);

Andrew J. Minnick, Ithaca, NY (US);

Charles W. Blackmer, Ithaca, NY (US);

Mollie K. Devoe, Ithaca, NY (US);

Assignee:

Kionix, Inc., Ithaca, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 3/00 (2006.01); G01P 15/08 (2006.01); H01L 29/87 (2006.01); H01H 59/00 (2006.01); H01L 29/747 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0008 (2013.01); G01P 15/0802 (2013.01); H01L 29/87 (2013.01); H01H 59/0009 (2013.01); H01L 29/747 (2013.01); B81B 2201/0235 (2013.01); B81B 2207/07 (2013.01);
Abstract

A micro-electromechanical system (MEMS) device can include a substrate and a first beam suspended relative to a substrate surface. The first beam can include a first portion and a second portion that are separated by an isolation joint made of an insulative material. The first and second portions can each include a first semiconductor and a first dielectric layer. The MEMS device can also include a second beam suspended relative to the substrate surface. The second beam can include a second semiconductor and a second dielectric layer to promote curvature of the second beam. The MEMS device can also include a third beam suspended relative to the substrate surface. The third beam consists essentially of a first material. The second beam is configured to move relative to the third beam in response to an acceleration along an axis perpendicular to the surface of the substrate.


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