The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Oct. 14, 2010
Lauren Palmateer, San Jose, CA (US);
Brian J. Gally, San Jose, CA (US);
William J. Cummings, San Jose, CA (US);
Manish Kothari, San Jose, CA (US);
Clarence Chui, San Jose, CA (US);
Lauren Palmateer, San Jose, CA (US);
Brian J. Gally, San Jose, CA (US);
William J. Cummings, San Jose, CA (US);
Manish Kothari, San Jose, CA (US);
Clarence Chui, San Jose, CA (US);
QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);
Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.