The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Aug. 12, 2013
Applicant:

Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;

Inventors:

Che-Hsang Huang, Hsinchu, TW;

Pin-Chuan Chen, Hsinchu, TW;

Lung-Hsin Chen, Hsinchu, TW;

Wen-Liang Tseng, Hsinchu, TW;

Yu-Liang Huang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); H01L 2224/48247 (2013.01); H01L 33/62 (2013.01); H01L 2224/48257 (2013.01); H01L 25/0753 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.


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