The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Aug. 31, 2010
Applicants:

Klaus Müller, Pettendorf, DE;

Günter Spath, Regensburg, DE;

Siegfried Herrmann, Neukirchen, DE;

Ewald Karl Michael Günther, Regenstauf, DE;

Herbert Brunner, Sinzing, DE;

Inventors:

Klaus Müller, Pettendorf, DE;

Günter Spath, Regensburg, DE;

Siegfried Herrmann, Neukirchen, DE;

Ewald Karl Michael Günther, Regenstauf, DE;

Herbert Brunner, Sinzing, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 31/0224 (2013.01);
Abstract

The invention relates to an optoelectronic component, having —a carrier () comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip () having no substrate, and —a contact metallization (), wherein —the carrier () is electrically insulating, —the at least one optoelectronic semiconductor chip () is fastened to the first main surface (Ia) of the carrier () by means of a bonding material (), particularly a solder material, —the contact metallization () covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (), and —the contact metallization () is electrically conductively connected to the optoelectronic semiconductor chip ().


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