The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jun. 16, 2011
Joerg Rockenberger, San Jose, CA (US);
Yu Chen, Pearland, TX (US);
Fabio Zürcher, Brisbane, CA (US);
Scott Haubrich, Albuquerque, NM (US);
Joerg Rockenberger, San Jose, CA (US);
Yu Chen, Pearland, TX (US);
Fabio Zürcher, Brisbane, CA (US);
Scott Haubrich, Albuquerque, NM (US);
Thin Film Electronics ASA, Oslo, NO;
Abstract
Metal ink compositions, methods of forming such compositions, and methods of forming conductive layers are disclosed. The ink composition includes a bulk metal, a transition metal source, and an organic solvent. The transition metal source may be a transition metal capable of forming a silicide, in an amount providing from 0.01 to 50 at. % of the transition metal relative to the bulk metal. Conductive structures may be made using such ink compositions by forming a silicon-containing layer on a substrate, printing a metal ink composition on the silicon-containing layer, and curing the composition. The metal inks of the present invention have high conductivity and form low resistivity contacts with silicon, and reduce the number of inks and printing steps needed to fabricate integrated circuits.