The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Jan. 30, 2013
E Ink Holdings Inc., Hsinchu, TW;
Ian French, Hsinchu, TW;
Chi-Ming Wu, Hsinchu, TW;
Shu-Hao Chang, Hsinchu, TW;
Ming-Sheng Chiang, Hsinchu, TW;
Shu-Ping Yan, Hsinchu, TW;
E Ink Holdings Inc., Hsinchu, TW;
Abstract
A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings.