The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Oct. 09, 2009
Andreas Voegerl, Parsberg, DE;
Tilo Liebl, Hersbruck, DE;
Gerhard Bauer, Graefenberg, DE;
Marion Gebhardt, Graefenberg, DE;
Alexander Wenk, Burgoberbach, DE;
Matthias Wieczorek, Neunkirchen am Sand, DE;
Juergen Henniger, Erlangen-Dechsendorf, DE;
Karl-heinz Baumann, Viernheim, DE;
Andreas Voegerl, Parsberg, DE;
Tilo Liebl, Hersbruck, DE;
Gerhard Bauer, Graefenberg, DE;
Marion Gebhardt, Graefenberg, DE;
Alexander Wenk, Burgoberbach, DE;
Matthias Wieczorek, Neunkirchen am Sand, DE;
Juergen Henniger, Erlangen-Dechsendorf, DE;
Karl-Heinz Baumann, Viernheim, DE;
Conti Temic microelectronic GmbH, Nuernberg, DE;
Carl Freudenberg KG, Weinheim, DE;
Abstract
A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (), several bonding surfaces () arranged on a solder side () of the carrier foil (), and several soldering surfaces () arranged on a bonding side () of the carrier foil () opposite the solder side. The soldering surfaces () are connected to the bonding surfaces () via electrical strip conductors, and a stiffening plate () is inseparably connected to the carrier foil () on the solder side thereof.