logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8853312 B1

PDFFull Text
Expired
Date of Patent:
Oct. 07, 2014

Filed:

Dec. 17, 2012

Resin composition and semiconductor device produced by using the same

Applicant:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Hikaru Okubo, Tochigi, JP;

Nobuki Tanaka, Tochigi, JP;

Itaru Watanabe, Tochigi, JP;

Assignee:

Sumitomo Bakelite Co., Ltd, Tokyo, JP;

Attorney:

Smith, Gambrell & Russell LLP

Primary Examiner:

Brieann R Fink

Int. Cl.
CPC ...
C08K 3/08 (2006.01); C08L 79/08 (2006.01); H01L 23/00 (2006.01); C09J 179/08 (2006.01); C09J 201/02 (2006.01); C08G 73/12 (2006.01); C08F 220/58 (2006.01); C08K 5/14 (2006.01); C08K 5/00 (2006.01); C08K 3/26 (2006.01); C08F 234/02 (2006.01);
U.S. Cl.
CPC ...
C08F 220/58 (2013.01); C08K 5/14 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/01006 (2013.01); H01L 24/83 (2013.01); H01L 2924/01015 (2013.01); H01L 24/29 (2013.01); H01L 2924/01013 (2013.01); C08K 5/0025 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01077 (2013.01); C09J 179/08 (2013.01); H01L 2924/30105 (2013.01); C08K 3/26 (2013.01); H01L 2924/12044 (2013.01); C09J 201/025 (2013.01); H01J 23/3737 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01046 (2013.01); H01L 2224/29111 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/01009 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01082 (2013.01); C08F 234/02 (2013.01); H01L 2924/01027 (2013.01); H01L 2224/8385 (2013.01); C08G 73/12 (2013.01); H01L 2924/0102 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01024 (2013.01); C08K 3/08 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01005 (2013.01); C08L 79/085 (2013.01);
Abstract

A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Find Patent Forward Citations

Okubo, Hikaru. (2014). Resin composition and semiconductor device produced by using the same (U.S. Patent No. 8853312). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8853312

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…