The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Sep. 28, 2009
Applicants:

Ayako Yano, Takasago, JP;

Noriko Noro, Takasago, JP;

Inventors:

Ayako Yano, Takasago, JP;

Noriko Noro, Takasago, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/52 (2006.01); C08G 65/336 (2006.01); C09J 175/08 (2006.01); C08G 18/48 (2006.01); C08L 71/02 (2006.01); C08G 18/71 (2006.01); C09J 171/02 (2006.01); C09K 3/10 (2006.01); C08L 101/10 (2006.01); C08K 5/31 (2006.01); C08K 5/51 (2006.01);
U.S. Cl.
CPC ...
C09K 3/10 (2013.01); C08G 65/336 (2013.01); C08L 101/10 (2013.01); C09J 175/08 (2013.01); C08G 18/4854 (2013.01); C08L 71/02 (2013.01); C08G 18/718 (2013.01); C08G 2190/00 (2013.01); C08K 5/31 (2013.01); C09J 171/02 (2013.01); C08K 5/51 (2013.01);
Abstract

The present invention aims to provide a curable composition without adverse effects on the environment, which exhibits excellent curability without containing a toxic organotin curing catalyst, and gives a cured product that does not have discoloration and cracks on the surface thereof even after being exposed to the atmosphere and ultraviolet light for a long time. The present invention also aims to provide the cured product. The curable composition comprises: (A) an organic polymer having a reactive silyl group; (B) a guanidine compound having a specific structure; and (C) a phosphorus compound that has an aryl group, has a phosphorus atom with an oxidation number of +5, and has a melting point of 23° C. or higher.


Find Patent Forward Citations

Loading…