The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Dec. 24, 2010
Masayuki Hanano, Hitachi, JP;
Eiichi Satou, Hitachi, JP;
Munehiro Oota, Hitachi, JP;
Kanshi Chinone, Hitachi, JP;
Masayuki Hanano, Hitachi, JP;
Eiichi Satou, Hitachi, JP;
Munehiro Oota, Hitachi, JP;
Kanshi Chinone, Hitachi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
An object of the present invention is to provide a polishing liquid for CMP with which polishing scratches can be reduced and a sufficiently high polishing rate can be obtained in a CMP step for an ILD film, aggregation of an abrasive grain is difficult to occur, and high flatness is obtained, and provide a polishing method using the same. The polishing liquid for CMP according to the present invention is a polishing liquid for CMP containing an abrasive grain, an additive, and water, wherein the abrasive grain comprises a cerium-based particle, and the additive comprises a 4-pyrone-based compound and at least one of a nonionic surfactant or a cationic surfactant: [wherein X, X, and Xeach independently represent a hydrogen atom or a monovalent substituent].